XCVC1902-2LLIVSVA2197
  • image of System On Chip (SoC)> XCVC1902-2LLIVSVA2197
XCVC1902-2LLIVSVA2197
Product_Category
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Description
IC VERSAL AICORE FPGA 2197BGA
Encapsulation
Packages
Tray
RoHS
YES
Price
$56,223.5625
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case2197-BFBGA, FCBGA
Speed450MHz, 1.08GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 1.9M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package2197-FCBGA (45x45)
ArchitectureMPU, FPGA
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