EVSC800-PI-2-K6
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EVSC800-PI-2-K6
Product_Category
Pads, Sheets
Manufacturer
CR Technology
Description
Thermal Insulation Pad
Encapsulation
Packages
Sheet
RoHS
YES
Price
$50.4000
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Specifications
PDF(1)
TYPEDESCRIPTION
MfrCR Technology
SeriesEVSC
PackageSheet
Product StatusACTIVE
ColorGray
MaterialSilicone
Thickness0.0063" (0.160mm)
TypeUltra Thin Dielectric Sheet
UsageMulti
Outline305.00mm x 305.00mm
Thermal Conductivity1.1W/m-K
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