Product_Category
System On Chip (SoC)
Manufacturer
Intel
Description
IC
Encapsulation
Packages
Tray
RoHS
NO
Price
$23,524.3365
| TYPE | DESCRIPTION |
| Mfr | Intel |
| Series | Agilex F |
| Package | Tray |
| Product Status | ACTIVE |
| Package / Case | 2340-BFBGA Exposed Pad |
| Speed | 1.4GHz |
| RAM Size | 256KB |
| Number of I/O | 480 |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Primary Attributes | FPGA - 2.3M Logic Elements |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 2340-BGA (45x42) |
| Architecture | MPU, FPGA |
